Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380606 | Semiconductor device including via structure with head and body portions | Eunji Kim, Kwangwuk Park, Sangjun Park, Daesuk Lee, Hakseung Lee | 2022-07-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380606 | Semiconductor device including via structure with head and body portions | Eunji Kim, Kwangwuk Park, Sangjun Park, Daesuk Lee, Hakseung Lee | 2022-07-05 |