Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11494642 | Thickness prediction network learning method, semiconductor device manufacturing method, and semiconductor material deposition equipment | Su-il Cho, Yu-Sin Yang, Chi Hoon Lee, Hyun-su Kwak, Jung-Won Kim | 2022-11-08 |