Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508681 | Semiconductor package and method of fabricating the same | Younhee Kang, Junghyun Roh | 2022-11-22 |
| 11315803 | Stress mitigation in organic laminates | Sri M. Sri-Jayantha | 2022-04-26 |