Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11504890 | Insert molding apparatus | Hyun Kyung Kim, Dong Eun Cha, Jin Young Yoon, Byung Kyu Yoon, Hwi Sung Jung +5 more | 2022-11-22 |
| 11393631 | Electronic component | Je Jung Kim, Su Kyoung Cha, Ji-Won Lee | 2022-07-19 |
| 11387044 | Multi-layered ceramic capacitor and method of manufacturing the same | Ji-Won Lee, Jun Ho Yun | 2022-07-12 |
| 11361904 | Multilayer electronic component | Je Jung Kim, Ji-Won Lee | 2022-06-14 |
| 11302483 | Electronic component | Je Jung Kim, Su Kyoung Cha, Ji-Won Lee | 2022-04-12 |