Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342283 | Package substrate and semiconductor package including the same | Byungwook Kim, Ayoung KIM, Seongwon Jeong | 2022-05-24 |
SH
Sangsu Ha
Overall (2022): #274,371 of 548,613Top 55%
1
Patents 2022