Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430824 | Integrated circuit devices having through-silicon via structures | Sun Hyun Kim, Byung-Jun Park | 2022-08-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430824 | Integrated circuit devices having through-silicon via structures | Sun Hyun Kim, Byung-Jun Park | 2022-08-30 |