Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515265 | Fan-out semiconductor package | Seon Hee Moon, Jin Gu Kim | 2022-11-29 |
| 11488768 | Coil component | Sa Yong Lee | 2022-11-01 |
| 11462498 | Semiconductor package including frame in which semiconductor chip is embedded | Yong Jin Park, Sang Kyu Lee, Moon Il Kim, Jeong Ho Lee, Young Gwan Ko | 2022-10-04 |