Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11421073 | Highly thermally conductive epoxy compound, and composition, material for semiconductor package, molded product, electric and electronic device and semiconductor package including the same | Jonghoon WON, In Hwan Kim, Kyeong Pang | 2022-08-23 |