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Minjun Bae

Samsung: 1 patents #7,077 of 17,243Top 45%
Overall (2022): #335,264 of 548,613Top 65%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11264354 Wafer level package Jinwoo Park, Jungho Park, Dahye Kim 2022-03-01