Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11232986 | Integrated circuit devices including enlarged via and fully aligned metal wire and methods of forming the same | Tae Yong Bae, Hoon Seok Seo, Hak-Sun Lee | 2022-01-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11232986 | Integrated circuit devices including enlarged via and fully aligned metal wire and methods of forming the same | Tae Yong Bae, Hoon Seok Seo, Hak-Sun Lee | 2022-01-25 |