Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322405 | Substrate dicing method, method of fabricating semiconductor device, and semiconductor chip fabricated by them | Jungchul Lee, Byungmoon Bae, Junggeun Shin, Hyunsu Sim | 2022-05-03 |