Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515283 | Flexible circuit film bonding apparatus and method of bonding flexible circuit film using the same | Chung-Seok Lee, EUNJEONG JEON | 2022-11-29 |
JL
Joongmok Lee
Overall (2022): #394,889 of 548,613Top 75%
1
Patents 2022