Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450634 | Package substrate and semiconductor package with elevated bonding pad, and comprising the same | — | 2022-09-20 |
JP
Jiwoo Park
Overall (2022): #403,533 of 548,613Top 75%
1
Patents 2022