Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462440 | Packaging structure | Fu-Cheng Chen | 2022-10-04 |
| 11306200 | Method for preparing organometallic composite material | Qun Chen, Haiqun Chen, Chunping Fang, Wen Yi, Feng Li +4 more | 2022-04-19 |