Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380651 | Semiconductor package including stacked semiconductor chips | Hong Bum Park, Suk Won Lee | 2022-07-05 |
| 11322435 | Package substrate having power trace pattern and ground trace pattern, and semiconductor package including the same | — | 2022-05-03 |
| 11222445 | Input apparatus for displaying a graphic corresponding to an input touch command and controlling method therefor | Young-ran Han | 2022-01-11 |