Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11492519 | Polyimide film for semiconductor package | Kye Ung LEE, Ju Hwan Chun, Tae-seok Lee | 2022-11-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11492519 | Polyimide film for semiconductor package | Kye Ung LEE, Ju Hwan Chun, Tae-seok Lee | 2022-11-08 |