Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502059 | Semiconductor package including a thermal pillar and heat transfer film | Jae Choon Kim, Yun-Seok Choi | 2022-11-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502059 | Semiconductor package including a thermal pillar and heat transfer film | Jae Choon Kim, Yun-Seok Choi | 2022-11-15 |