Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11443965 | Wafer to wafer bonding apparatuses | Kyeongbin Lim, Hyeonjun Yun, Jewon Lee, Minsoo Han, Junhyung Kim +1 more | 2022-09-13 |
GJ
Gwanghee Jo
Overall (2022): #441,421 of 548,613Top 85%
1
Patents 2022