Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11276633 | Semiconductor package having UBM pad with gap separating central portion from peripheral portion | Gayoung Kim | 2022-03-15 |
DK
Duckgyu Kim
Overall (2022): #468,541 of 548,613Top 90%
1
Patents 2022