Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417386 | Semiconductor device having interconnection in package and method for manufacturing the same | Jaehyung Lee, Jungsik Kim, Youngdae Lee, Duyeul Kim, Sungmin Yim +1 more | 2022-08-16 |
| 11328760 | Semiconductor device having interconnection in package and method for manufacturing the same | Jaehyung Lee, Jungsik Kim, Youngdae Lee, Duyeul Kim, Sungmin Yim +1 more | 2022-05-10 |