Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11511375 | Multi component solid solution high-entropy alloys | Jianxun Hu, Justin Brown, Peiyong Chen, Xuesong Fan, John William Bohling +4 more | 2022-11-29 |
| 11442879 | Interrupt request processing device | — | 2022-09-13 |