Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515223 | Package structure, semiconductor device, and formation method for package structure | — | 2022-11-29 |
| 11264280 | Semiconductor device manufacturing method and wafer-attached structure | Masatoshi AKETA | 2022-03-01 |