Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11266027 | Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor | Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang | 2022-03-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11266027 | Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor | Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang | 2022-03-01 |