Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11217670 | Semiconductor device having a back electrode including Au-Sb alloy layer and method of manufacturing the same | Yuji Takahashi, Masaki Watanabe, Kentaro Yamada, Masaki Sakashita, Shinichi Maeda +1 more | 2022-01-04 |