Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424206 | Chip package module including flip-chip ground pads and power pads, and wire-bonding ground pads and power pads | Sheng-Feng Chung | 2022-08-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424206 | Chip package module including flip-chip ground pads and power pads, and wire-bonding ground pads and power pads | Sheng-Feng Chung | 2022-08-23 |