Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11317505 | Double-sided, high-density network fabrication | Brian Atwood, Thang Nguyen, Sankerlingam Rajendran, Walter B. Aschenbeck, Jr. | 2022-04-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11317505 | Double-sided, high-density network fabrication | Brian Atwood, Thang Nguyen, Sankerlingam Rajendran, Walter B. Aschenbeck, Jr. | 2022-04-26 |