Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462460 | Electrical module assembly with embedded dies | Kyu-Pyung Hwang | 2022-10-04 |
| 11378605 | Method for high-intensity radiated field (HIRF) and electromagnetic pulse (EMP) analysis of a vehicle | Kyu-Pyung Hwang | 2022-07-05 |