Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11348798 | Methods of forming integrated circuit devices using cutting tools to expose metallization pads through a cap structure and related cutting devices | Brook Hosse | 2022-05-31 |
| 11244884 | Semiconductor package with floating heat spreader and process for making the same | — | 2022-02-08 |