Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11244786 | Substrates with integrated three dimensional inductors with via columns | Dirk Robert Walter Leipold, George Maxim, Baker Scott | 2022-02-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11244786 | Substrates with integrated three dimensional inductors with via columns | Dirk Robert Walter Leipold, George Maxim, Baker Scott | 2022-02-08 |