Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11523495 | Multilayer PCB structure with inner thermally conductive material, optical communication module having the same and method of fabricating the same | Che-Shou Yeh, Cheng-Ta Tsai, Shih-Cheng Lin | 2022-12-06 |