Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11491567 | Soldering device and a method for producing a solder connection of components using adhesive material for temporary connection of the components | Aaron Hutzler | 2022-11-08 |
| 11351623 | Heat transfer device for producing a soldered connection of electrical components | Sebastian Clärding | 2022-06-07 |