Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538790 | Extended HBM offsets in 2.5D interposers | Mohamed Anwar Ali, Tauman T. Lau | 2022-12-27 |
| 11463397 | Multi-blockchain proof-of-activity platform | — | 2022-10-04 |
| 11405589 | Interactive video conferencing interface | — | 2022-08-02 |