Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11503706 | Elastic circuit board and patch device in which same is used | Tomoaki Sawada, Tomohiro Fukao | 2022-11-15 |
| 11345784 | Resin composition, and resin film, metal foil with resin, metal clad laminate, wiring board, and circuit mount component using same | Kyosuke MICHIGAMI, Tomoaki Sawada, Tomohiro Fukao, Andy Behr | 2022-05-31 |
| 11239004 | Conductive resin composition and conductive structure using same | Tomohiro Fukao, Tomoaki Sawada | 2022-02-01 |