Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11414573 | Adhesive composition | Tetsuyuki SHIRAKAWA, Satoru Matsumoto, Yusuke Asakawa, Tatsuya KUMADA | 2022-08-16 |
| 11355469 | Connection structure and method for producing same | Tetsuyuki SHIRAKAWA, Shinnosuke Iwamoto | 2022-06-07 |
| 11242472 | Adhesive film | Tetsuyuki SHIRAKAWA, Hiroyuki Izawa, Tatsuya KUMADA | 2022-02-08 |