Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456200 | Substrate fixing apparatus including a base plate, an electrostatic adsorption member, a plurality of support members on the base plate and supporting the electrostatic adsorption member, and an adhesive layer bonding the electrostatic adsorption member to the base plate | Nobuyuki Iijima, Hiroharu Yanagisawa, Yuichi Nakamura | 2022-09-27 |
| 11414528 | Thermosetting resin composition, prepreg, metal-clad laminate, printed wiring board, film with resin, and metal foil with resin | Shimpei Obata, Yasunori AMBE, Tomo MUGURUMA | 2022-08-16 |
| 11247192 | Packing material for HILIC columns, HILIC column filled with same, and method for analyzing oligosaccharide with use of same | Junya Kato, Hideyuki Kondo | 2022-02-15 |