Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11473199 | Method and apparatus for depositing a multi-sector film on backside of a semiconductor wafer | Seiji Shimabukuro | 2022-10-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11473199 | Method and apparatus for depositing a multi-sector film on backside of a semiconductor wafer | Seiji Shimabukuro | 2022-10-18 |