Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515280 | Mounting structure and nanoparticle mounting material | Hidetoshi Kitaura, Akio Furusawa | 2022-11-29 |
| 11515281 | Bonded structure and bonding material | Akio Furusawa, Shinji Ishitani | 2022-11-29 |
| 11476399 | Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor device | Hidetoshi Kitaura, Akio Furusawa | 2022-10-18 |
| 11318534 | Metal microparticle production method and metal microparticle production device | Akio Furusawa, Shinji Ishitani, Misato Takahashi | 2022-05-03 |