MF

Matthias Fettke

PG Pac Tech—Packaging Technologies Gmbh: 2 patents #1 of 4Top 25%
Overall (2022): #133,792 of 548,613Top 25%
2
Patents 2022

Issued Patents 2022

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11367709 Semiconductor chip stack arrangement and semiconductor chip for producing such a semiconductor chip stack arrangement Andrej Kolbasow 2022-06-21
11217558 Method and device for establishing a wire connection as well as a component arrangement having a wire connection Andrej Kolbasow, Jan Hoffmann 2022-01-04