Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476148 | Wafer separating apparatus, and wafer separating method | Shinsuke Inoue | 2022-10-18 |
| 11459680 | Sewing device | Kazuma Nakayama, Tohru Takamura | 2022-10-04 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476148 | Wafer separating apparatus, and wafer separating method | Shinsuke Inoue | 2022-10-18 |
| 11459680 | Sewing device | Kazuma Nakayama, Tohru Takamura | 2022-10-04 |