Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11408781 | Thermal sensor package for earbuds | Chein-Hsun Wang, Ming Le, Yu-Chih LIANG, Tung-Yang Lee | 2022-08-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11408781 | Thermal sensor package for earbuds | Chein-Hsun Wang, Ming Le, Yu-Chih LIANG, Tung-Yang Lee | 2022-08-09 |