Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450616 | Using a backside mask layer for forming a unique die mark identifier pattern | David Robert Currier, Fred Reece Clayton, Alan J. Magnus, Warren Crapse | 2022-09-20 |
| 11444044 | Transistor die with output bondpad at the input side of the die, and power amplifiers including such dies | Ibrahim Khalil, Ning Zhu, Damon G. Holmes | 2022-09-13 |