Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508669 | Method and apparatus for improved circuit structure thermal reliability on printed circuit board materials | Jeroen Johannes Maria Zaal, Michiel van Soestbergen, Romuald Olivier Nicolas Roucou | 2022-11-22 |