Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488904 | System and method for reducing mutual coupling for noise reduction in semiconductor device packaging | Ajay Sharma, Rishi Bhooshan, Sumit Varshney | 2022-11-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488904 | System and method for reducing mutual coupling for noise reduction in semiconductor device packaging | Ajay Sharma, Rishi Bhooshan, Sumit Varshney | 2022-11-01 |