Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495568 | IC package design and methodology to compensate for die-substrate CTE mismatch at reflow temperatures | Jayprakash Chipalkatti, Don Templeton, Brian Schieck, Julie Lam, Prashant Pathak | 2022-11-08 |