Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456215 | Manufacturing method for semiconductor device | Tomoaki Ichikawa | 2022-09-27 |
| 11352527 | Sinter-bonding composition, sinter-bonding sheet and dicing tape with sinter-bonding sheet | Tomoaki Ichikawa, Yuki Sugo, Mayu Shimoda | 2022-06-07 |