Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11338488 | Mold clamping device | Hozumi Yoda, Satoshi Hoshino, Hiroo Okubo, Keiichi Tozawa | 2022-05-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11338488 | Mold clamping device | Hozumi Yoda, Satoshi Hoshino, Hiroo Okubo, Keiichi Tozawa | 2022-05-24 |