Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11276584 | Substrate with glass sheet, resin layer and through-glass via | Keiji Tsunetomo, Hideki Hashizume | 2022-03-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11276584 | Substrate with glass sheet, resin layer and through-glass via | Keiji Tsunetomo, Hideki Hashizume | 2022-03-15 |