Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11477354 | Camera module and molded circuit board assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao | 2022-10-18 |
| 11388320 | Photosensitive component, and camera module and manufacturing method therefor | Mingzhu Wang, Zhenyu Chen, Zhongyu Luan, Zhen Huang, Nan Guo +5 more | 2022-07-12 |
| 11363184 | Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao | 2022-06-14 |
| 11223751 | Photosensitive assembly and camera module and manufacturing method thereof | Mingzhu Wang, Zhenyu Chen, Takehiko Tanaka, Zhongyu Luan, Bojie Zhao +4 more | 2022-01-11 |