Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257744 | Method of forming vias using silicon on insulator substrate | Toshiyuki Maenosono, Yuta KIKUCHI, Yoshihiro Saeki | 2022-02-22 |
MI
Manabu Ito
Overall (2022): #348,466 of 548,613Top 65%
1
Patents 2022