Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11315899 | Die bonding material, light-emitting device, and method for producing light-emitting device | Akiko Umeda, Manabu Miyawaki, Hidekazu Nakayama, Hiroki Inoue | 2022-04-26 |